25-50% Rabatt
BournsSF-1206HV15M-2Sicherungen
Fuse Chip 15A 35V SMD Solder Pad 1206 Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Battery Charger|Cell Phone|Digital Camera|Disk Drive|Industrial Controller | |
| 3.2 X 1.6 X 0.97 | |
| 15 | |
| 35 | |
| 35 | |
| 150@35VDC | |
| 35 | |
| 0.0032 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 0.97 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.