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BournsSF-0603FP125M-2Sicherungen
Fuse Chip Fast Acting 1.25A 32V SMD Solder Pad 0603 1.6 X 0.8 X 0.3mm Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Fast | |
| Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller | |
| 1.6 X 0.8 X 0.3 | |
| 1.25 | |
| 32 | |
| 32 | |
| 35@32VDC | |
| 0.0636 | |
| 0.204 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 150 | |
| Tape and Reel | |
| 0.8 | |
| 1.6 | |
| 0.3 | |
| Ceramic | |
| Surface Mount | |
| 0603 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.